Chipsets

Wi-Fi 8 is ‘engineered specifically’ to meet the requirements of our AI future, says MediaTek In sum – what to know: Reliability and latency over speed – Wi-Fi 8’s emphasis on intelligence, reliability, and efficiency reflects the needs of AI-driven …

NXP has acquired Port GmbH to integrate industrial protocol software into its processors – as the Dutch firm seeks to assert control over the most critical point in the industrial IoT value chain: the edge. In sum – what to …

The move by the Government of Korea follows reports that U.S. President Trump intends to soon unveil new tariff rates on imported semiconductors In brief – why this matters –South Korea has unveiled a massive KRW 33 trillion ($23.25 billion) …

As agentic AI gains traction, chipmakers like MediaTek are building for a future where devices anticipate and execute complex tasks autonomously This week, MediaTek announced the Dimensity 9400+, the latest addition to its flagship Dimensity chipset family. Designed for next-gen …

Unlike traditional CPUs or GPUs, a Tensor Processing Unit is specifically built to handle the complex calculations required for deep learning models Artificial intelligence (AI) is changing the world, and powerful hardware is needed to support its growth. One of …

  As artificial intelligence (AI) continues to evolve, the demand for faster and more efficient computing is growing at a fast pace. One of the key innovations helping to meet this growing demand is chiplet technology. This approach to chip …

The new module is compatible with Quectel 4G module EG2x series modules with smaller sizes Global IoT company Quectel Wireless Solutions announced the commercial availability of its new 5G RedCap Sub-6 GHz LGA module, which will deliver 5G and 4G …

The new facility inaugurated by Qualcomm required a total investment of $22 million U.S. chipmaker Qualcomm has inaugurated its design center in Chennai, India, according to Indian press reports. The new facility was inaugurated by Ashwini Vaishnaw, India’s Minister of …

The XR2+ Gen 2 comes with more GPU and AI capabilities; Qualcomm named Google and Samsung as among OEM partners Ahead of the Consumer Electronics Show starting today in Las Vegas, Qualcomm announced the latest-and-greatest in Extended Reality (XR) silicon …

MediaTek says its latest Dimensity chipset enhances applications like gaming, video capture and generative AI processing MediaTek has announced the latest flagship mobile chip to its lineup, the Dimensity 9300 chipset. The new chipset has an embedded AI processor — …

The interoperability development testing (IoDT) took place at an Ericsson lab in Sweden Ericsson has teamed up with chipset maker MediaTek to perform 5G Reduced Capability (RedCap) data and 5G voice calls on both frequency division duplex (FDD) and time …

The record was achieved using the Qualcomm Snapdragon X75 chipset Qualcomm has claimed a new record, achieving a download rate of 7.5 Gb/s in sub-6 GHz bands using a Standalone (SA) 5G network configuration, four-channel carrier aggregation (4CA) and its …

Ericsson said that the combination of frequencies used was 50 megahertz FDD n1 and 100 megahertz TDD n77 Ericsson and MediaTek said they have set a new 5G upload speed record of 440 Mbps in low-band and mid-band spectrum using uplink carrier …

I recently had the pleasure of reviewing the Oppo Find N2 Flip phone, which features a MediaTek Dimensity 9000+ chip, and I have been eagerly waiting for MediaTek to release its latest Dimensity refresh, the 9200+. The Dimensity 9200 (without …

Samsung Electronics has announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100, for use in mobile, automotive, and IoT devices. The new hardware solution offers precise distance measurements, down to “single-digit centimetres”, reckons the South Korean firm. It has …

Want to know the latest with Sony’s smart label, the ground-breaking massive IoT use-case the firm’s Israeli IoT chip division prototyped with German pharmaceuticals company Bayer a couple of years back? Because it is still going, and about to get …

There is a clear dichotomy in the cellular IoT market – high-throughput and high-power IoT applications powered by advanced 4G (LTE) and 5G at one end, and low-throughput and low-power applications powered by cellular IoT technologies like NB-IoT and LTE-M …

Siemens has worked with Qualcomm to deploy an indoor private 5G network in CBRS spectrum at Siemens headquarters in Chicago, with a view to test and develop solutions to automate building functions and services. The private 5G trial network is …

Australian outfit Konvoy Group started three years ago, in the summer of 2019, as a keg rental business, offering logistics support to craft brewers in its home country. It has, in the meantime, expanded its services portfolio, launched in international …

Sony Semiconductor Israel has introduced a new dual-band low-power cellular IoT chipset solution which it claims is the “first” to combine the both LTE-M and NB-IoT in a single integrated modem. The new ALT1350 chipset also supports satellite (non-terrestrial; NTN) …

Semiconductor firm Skyworks Solutions claims to have produced the world’s smallest dual-mode cellular IoT system-in-package (SiP) solution. The US outfit partnered with IoT chip and module maker Sequans Communications on the product, numbered SKY66431, to combine the France-based firm’s Monarch …

Barcelona-based antenna company Ignion has launched a digital-twin prototyping tool for IoT devices with up to five radios. The latest version of its Antenna Intelligence Cloud (AIC) product, which ostensibly removes the need to start with a physical prototype, supports …