MediaTek Dimensity 6100+ SoC offers enhanced power efficiency, AI-powered camera technologies and reliable Sub-6 5G connectivity
MediaTek has launched its new Dimensity 6000 series, beginning with a chipset for mainstream 5G devices. The new SoC — the Dimensity 6100+ — integrates an enhanced 5G modem supporting the 3GPP Release 16 standard with up to 140 MHz 2CC 5G Carrier Aggregation, which the company said significantly reduces power consumption. The chip also houses two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, which provides support for AI-powered cameras, 10-bit displays and improved UX and GPU performance.
“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity,” said CH Chen, deputy general manager of MediaTek’s Wireless Communications Business Unit. “The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.”
In summation, said MediaTek, the Dimensity 6100+ SoC offers enhanced power efficiency, vivid displays, high frame rates, AI-powered camera technologies, low-power consumption and reliable Sub-6 5G connectivity. Further, due to its affordable price point, “the new Dimensity 6000 series will… democratize higher-end features to mainstream 5G devices,” according to the company.
Additional key features of the Dimensity 6100+ chipset include up to 108MP Non-ZSL camera support; up to 2K 30fps video capture; and UltraSave 3.0+ technology, which offers 20% reduced 5G power consumption compared to competitive solutions.
MediaTek’s Dimensity 5G portfolio includes the 9000 series, which is designed for flagship smartphones and tablets; the 8000 series for premium mobile devices; and the 7000 lineup, which expands the company’s range of high-tech devices.
The first smartphones featuring the Dimensity 6100+ chipset are scheduled for the third quarter of 2023.
