On the showfloor at the Common Platform Technology Forum in Santa Clara on Tuesday, RCR managed to track down Simon Segars, executive VP and general manager of ARM’s physical IP division to talk us through the ins and outs of chip IP and design.
ARM, which has just renewed its collaboration with the IBM alliance to work on IP for chips as tiny as 14nm, believes that manufacturing collaboration ensures greater efficiency and lower costs, which means its partners can manufacture many more mobile chips.
We talked to Simon about the delicate balance between high performance chips with the lowest possible power, and just how difficult this was to achieve.
Watch the interview below:
ARM talks us through higher performance with lower power
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The IEA report predicts that AI processing in the U.S. will need more electricity than all heavy industries combined, such as steel, cement and chemicals
Energy demand for AI data centers in the U.S. is expected to grow about 50 gigawatt each year for the coming years, according to Aman Khan, CEO of International Business Consultants