YOU ARE AT:Archived ArticlesTI delivers 130-nanometer process technology on 300-millimeter wafer

TI delivers 130-nanometer process technology on 300-millimeter wafer

DALLAS-Texas Instruments said it has delivered 130-nanometer process technology on 300-millimeter wafers, which can contain millions of highly integrated processors built in the company’s DMOS 6 facility.

The company said Sun Microsystems’ UltraSPARC microprocessors are scheduled to sign up for the product.

“The investment return is significant in terms of reduced cost per die and higher performance processors, but just as important, it is proof of TI’s leadership role in the competition for advanced manufacturing capability,” said Dan Hutcheson of VLSI Research Inc.

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