Apple to dump Samsung, move chip fabbing to TSMC

Apple may dump Samsung and move to Taiwanese chip manufacturer TSMC for production of its A6 chip, it has been claimed.
According to ComputerWorld, the 28nm chip will be fabbed in Taiwan, rather than Korea, after a spate of legal disputes between Apple and Samsung this year.
Though not much is known about the upcoming A6, rumor has it that the chip supports 3D functionality and may be quad core, lending credence to the speculation that iPad 3 will sport a host of 3D features.
While TSMC is a manufacturing house of repute and choice of many in the IT industry – making chips for the likes of Nvidia, AMD, and Qualcomm – some analysts worry that the fab wouldn’t be able to cope with the demand pumping out Apple chips could engender.
The fab has had yield issues in the past, especially when it comes to new process technology.
Nevertheless, word on the Taiwanese street is that the details and specs of the A6 have already made their way to the fab, and now it’s just a question of finalizing the order. Whether the move proves to be a good one or a dangerous gamble remains to be seen.