PHILADELPHIA-This week’s IEEE MTT-S 2003 trade show prompted power amplifier announcements from industry players, including RF Micro Devices Inc. and Analog Devices Inc.
RF Micro Devices Inc. announced availability of the RF3146, the third generation of its PowerStar GSM power amplifier module, with integrated power control technology. The new solution features RFMD’s patent-pending Lead Frame Module packaging technology, which eliminates surface mount devices and their associated costs.
Analog Devices introduced the ADL5552 X-PA, its next-generation quad-band X-PA power amplifier module for GSM/GPRS cellular phones. The PA module features integrated control loop architecture and single-point calibration. The solution uses directional coupling within its power control loop to effectively control output power in phones.
