QUALCOMM SIGNS JAPAN AGREEMENT | RCR Wireless

QUALCOMM SIGNS JAPAN AGREEMENT

by Reily Gregson

SAN DIEGO-Qualcomm Inc. announced it has signed a multimillion dollar worldwide subscriber equipment license with Nippondenso Co. Ltd., a Japanese manufacturer and worldwide automotive component supplier.

The license allows Nippondenso to manufacture and sell subscriber products based on Qualcomm’s Code Division Multiple Access technology, Qualcomm said.

You may also like