Qualcomm to spinoff Leap
SAN DIEGO-Qualcomm Inc. announced a record date of Sept. 11 for the proposed spinoff of Leap Wireless International Inc.
The board declared a one-share dividend of Leap for every four outstanding shares of Qualcomm. The distribution of Leap is expected to occur around Sept. 23 to shareholders of record Sept. 11.
Qualcomm plans to transfer assets of about $260 million to Leap at the time of distribution, the company said.
Harvey P. White, a co-founder and former president of Qualcomm, will become president, chief executive officer and chairman of the board of Leap.
Motorola to deliver phones to BAM
LIBERTYVILLE, Ill.-Motorola Inc.’s Personal Communications Sector said it has signed its first Code Division Multiple Access cellular handset agreement with Bell Atlantic Mobile.
The $100 million deal order includes Motorola’s SC-725 CDMA handset that BAM is featuring exclusively in new newspaper and magazine advertisements that highlight the carrier’s new pricing plans.
Motorola initially was scheduled to release the SC-725 last year.
DSP offers WorldCDMA multimode chipset
CUPERTINO, Calif.-DSP Communications Inc. introduced its WorldCDMA ARM integrated multimode baseband chipset, the D5421.
DSPC plans to offer samples to customers in the fourth quarter. The new chipset offers size, cost and power reductions over previous generations. With an integrated ARM7 TDMIa MCU and OAKa digital signal processing core, a single Code Division Multiple Access digital ASIC and an analog interface ASIC, the chipset provides a compact solution for satisfying cdmaOne baseband processing requirements, said DSPC. The highly integrated Interim Standard-95B compliant WorldCDMA chipset provides power management leading to low-power consumption, while adding functionality such as voice recognition.
